Heat Dissipation Adhesive for semiconductor
The biggest topic in the automotive and electrical and electronic fields is
“how to fuse many electronic devices to be lighter and thinner”. As customers
demand smaller, thinner, lighter and more versatile, the elements that make up electronic
devices are being used more and more closely.
Due to the high integration of these electronic devices, electronic products generate more heat,
and the heat emitted from the inside of the product deteriorates the functions of
peripheral devices and causes malfunctions and substrate deterioration.
Accordingly, the demand for “high heat dissipation materials” that can effectively dissipate
heat is increasing, and semiconductor heat dissipation adhesives are used in such places.
Fine Nano’s Heat Dissipation Adhesive
- Copper-based heat dissipation adhesive
- Silver-based heat dissipation adhesive
The role of Fine Nano’s
Heat Dissipation Adhesive
This is advantageous for manufacturing parts that consume
high power and generate a lot of heat, such as power devices and
LED modules, because the thermal conductivity of the base metal
substrate can be used.
The application market and use of
Fine Nano’s Heat Dissipation Adhesive
It is applied to high heat dissipation areas in automobiles and
electrical and electronic fields, and serves as a core material that
helps prevent deterioration of semiconductor performance through
optimal heat dissipation.